Cheng-Gong Han1,2,†, Xin Qian3,†, Qikai Li1,4, Biao Deng1, Yongbin Zhu1, Zhijia Han1, Wenqing Zhang5, Weichao Wang6, Shien-Ping Feng4, Gang Chen3,*, Weishu Liu1,2,*
南方科技大学刘玮书教授，美国国家工程院院士、麻省理工学院教授陈刚
1 Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
2 Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
3 Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
4 Department of Mechanical Engineering, The University of Hong Kong, Pokfulam, Hong Kong 999077, China.
5 Department of Physics and Shenzhen Institute for Quantum Science and Technology, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
6 Department of Electronics and Tianjin Key Laboratory of Photo-Electronic Thin Film Device and Technology, Nankai University, Tianjin 300071, China.
† These authors contributed equally to this work.
